Patent Assignment
Reel/Frame 020771/0827
Assignment of Assignor's Interest
Recorded: 2008-04-08
Pages: 2
Assignors
FUKAMIZU, SHINGO
Executed: 2007-11-20
NABESHIMA, YUTAKA
Executed: 2007-11-13
YAMAMOTO, YASUNORI
Executed: 2007-11-14
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Semiconductor Integrated Circuit Providing for Wire Bonding Directly Above an Active Circuit Region, and Manufacturing Method Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 21, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0606 →
Lien
Jan 13, 2014
From: COLLABO INNOVATIONS, INC.
To: PANASONIC CORPORATION
Reel/Frame 031997/0445 →
Assignment of Assignor's Interest
May 26, 2014
From: PANASONIC CORPORATION
To: COLLABO INNOVATIONS, INC.
Reel/Frame 033021/0806 →