IP Library Assignment 020777/0729
Patent Assignment
Reel/Frame 020777/0729

Assignment of Assignor's Interest

Recorded: 2008-04-07 Pages: 4
Assignors
SCHUPP, DETLEF
Executed: 2008-02-13
VAN LUU, THIN
Executed: 2008-02-13
Assignee
VISTEC SEMICONDUCTOR SYSTEMS GMBH
KUBACHER WEG 4, WEILBURG, 35781, GERMANY
Covered Property (1)
Method for Acquiring High-Resolution Images of Defects on the Upper Surface of the Wafer Edge
Patent: 7,768,637 →
Application: 12/072,156 →
Publication: US 2008/0204738
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 21, 2008
From: SCHUPP, DETLEF; VAN LUU, THIN
To: VISTEC SEMICONDUCTOR SYSTEMS GMBH
Reel/Frame 020989/0492 →