Patent Assignment
Reel/Frame 020779/0922
Assignment of Assignor's Interest
Recorded: 2008-03-31
Pages: 3
Assignee
SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
398, HASE ATSUGI-SHI, KANAGAWA-KEN, 243-0036, JAPAN
Covered Property
(1)
A Method of Joining a Plurality of Soi Substrates on a Glass Substrate by a Heat Treatment