Patent Assignment
Reel/Frame 020780/0239
Assignment of Assignor's Interest
Recorded: 2008-04-07
Pages: 4
Assignor
KOIKE, JUNICHI
Executed: 2008-04-01
Assignee
ADVANCED INTERCONNECT MATERIALS, LLC
6-6-40-402, AZA-AOBA, ARAMAKI, AOBA-KU, SENDAI, MIYAGI, 980-0845, JAPAN
Covered Property
(1)
Semiconductor Device, Its Manufacturing Method, and Sputtering Target Material for Use in the Method
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 23, 2016
From: ADVANCED INTERCONNECT MATERIALS, LLC
To: TOHOKU UNIVERSITY
Reel/Frame 038078/0852 →
Assignment of Assignor's Interest
Jun 29, 2017
From: TOHOKU UNIVERSITY
To: MATERIAL CONCEPT, INC.
Reel/Frame 042859/0773 →
Change of Address
Dec 8, 2021
From: MATERIAL CONCEPT, INC.
To: MATERIAL CONCEPT, INC.
Reel/Frame 058393/0355 →
Assignment of Assignor's Interest
Dec 9, 2021
From: MATERIAL CONCEPT, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 058347/0484 →