IP Library › Assignment 058393/0355
Patent Assignment
Reel/Frame 058393/0355

Change of Address

Recorded: 2021-12-08 Pages: 45
Assignor
MATERIAL CONCEPT, INC.
Executed: 2020-09-03
Assignee
MATERIAL CONCEPT, INC.
468-1-201 AZA-AOBA, ARAMAKI, AOBA-KU, SENDAI-SHI, MIYAGI, 9800845, JAPAN
Covered Properties (4)
Semiconductor Device, Its Manufacturing Method, and Sputtering Target Material for Use in the Method
Patent: 8,188,599 →
Application: 11/912,393 →
Publication: US 2009/0212432
Copper Interconnection Structure, Barrier Layer Including Carbon and Hydrogen
Patent: 7,755,192 →
Application: 12/383,524 →
Publication: US 2009/0243112
Copper Interconnection, Method for Forming Copper Interconnection Structure, and Semiconductor Device
Patent: 8,258,626 →
Application: 12/586,043 →
Publication: US 2010/0065967
Copper Interconnection Structure and Method for Forming Copper Interconnections
Patent: 8,324,730 →
Application: 12/589,852 →
Publication: US 2010/0155951
Related Assignments (15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 7, 2008
From: KOIKE, JUNICHI
To: ADVANCED INTERCONNECT MATERIALS, LLC
Reel/Frame 020780/0239 →
Assignment of Assignor's Interest Apr 17, 2009
From: SHIBATOMI, AKIHIRO
To: ADVANCED INTERCONNECT MATERIALS LLC
Reel/Frame 022576/0740 →
Assignment of Assignor's Interest Apr 17, 2009
From: KOIKE, JUNICHI
To: TOHOKU UNIVERSITY
Reel/Frame 022576/0752 →
Assignment of Assignor's Interest Oct 16, 2009
From: SHIBATOMI, AKIHIRO
To: ADVANCED INTERCONNECT MATERIALS LLC
Reel/Frame 023387/0794 →
Assignment of Assignor's Interest Oct 16, 2009
From: KOIKE, JUNICHI
To: NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY
Reel/Frame 023398/0700 →
Assignment of Assignor's Interest Dec 3, 2009
From: KOIKE, JUNICHI
To: TOHOKU UNIVERSITY
Reel/Frame 023606/0779 →
Assignment of Assignor's Interest Dec 3, 2009
From: SHIBATOMI, AKIHIRO
To: ADVANCED INTERCONNECT MATERIALS LLC
Reel/Frame 023606/0775 →
Assignment of Assignor's Interest Mar 21, 2011
From: TOHOKU UNIVERSITY
To: ADVANCED INTERCONNECT MATERIALS, LLC
Reel/Frame 026008/0715 →
Assignment of Assignor's Interest Mar 21, 2011
From: TOHOKU UNIVERSITY
To: ADVANCED INTERCONNECT MATERIALS, LLC
Reel/Frame 026002/0918 →
Assignment of Assignor's Interest Mar 23, 2016
From: ADVANCED INTERCONNECT MATERIALS, LLC
To: TOHOKU UNIVERSITY
Reel/Frame 038078/0852 →
Assignment of Assignor's Interest Jun 29, 2017
From: TOHOKU UNIVERSITY
To: MATERIAL CONCEPT, INC.
Reel/Frame 042859/0773 →
Assignment of Assignor's Interest Dec 9, 2021
From: MATERIAL CONCEPT, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 058347/0484 →
Assignment of Assignor's Interest Dec 9, 2021
From: MATERIAL CONCEPT, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 058433/0703 →
Assignment of Assignor's Interest Dec 9, 2021
From: MATERIAL CONCEPT, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 058347/0537 →
Assignment of Assignor's Interest Dec 9, 2021
From: MATERIAL CONCEPT, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 058347/0498 →