Copper interconnection, method for forming copper interconnection structure, and semiconductor device
View Patent ↗A copper interconnection structure includes an insulating layer, an interconnection body including copper and a barrier layer surrounding the interconnection body. The barrier layer includes a first barrier layer formed between a first portion of the interconnection body and the insulating layer. The first portion of the interconnection body is part of the interconnection body that faces the insulating layer. The barrier layer also includes a second barrier layer formed on a second portion of the interconnection body. The second portion of the interconnection body is part of the interconnection body not facing the insulating layer. Each of the first and the second barrier layers is formed of an oxide layer including manganese, and each of the first and the second barrier layers has a position where the atomic concentration of manganese is maximized in their thickness direction of the first and the second barrier layers.
1. A copper interconnection structure comprising:
an insulating layer;
an interconnection body including copper; and
a barrier layer surrounding the interconnection body, wherein the barrier layer comprises:
a first barrier layer formed between a first portion of said interconnection body and the insulating layer, wherein the first portion of said interconnection body is part of the interconnection body that faces the insulating layer, and
a second barrier layer formed on a second portion of said interconnection body, wherein the second portion of said interconnection body is part of the interconnection body not facing the insulating layer, and
wherein:
each of said first and said second barrier layers is formed of an oxide layer including manganese, and
each of said first and said second barrier layers has a position where the atomic concentration of manganese is maximized in their thickness direction of said first and said second barrier layers,
wherein the maximum atomic concentration of manganese in the second barrier layer is greater than the atomic concentration of manganese in the first barrier layer.
2. The copper interconnection structure of claim 1 , wherein the second barrier layer comprises an atomic concentration of oxygen maximized in close proximity to the position where the atomic concentration of manganese is maximized.
3. The copper interconnection structure of claim 2 , wherein oxygen in the second barrier layer is symmetrically distributed centering around the position where the atomic concentration of oxygen is maximized in the thickness direction.
4. The copper interconnection structure of claim 1 , wherein manganese in the second barrier layer is symmetrically distributed centering around the position where the atomic concentration of manganese is maximized in the thickness direction.
5. A semiconductor device having a copper interconnection structure as a circuit interconnection, wherein said copper interconnection structure is the copper interconnection structure recited in claim 1 .