Patent Assignment
Reel/Frame 023398/0700
Assignment of Assignor's Interest
Recorded: 2009-10-16
Pages: 4
Assignor
KOIKE, JUNICHI
Executed: 2009-09-03
Assignee
NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY
1-1, KATAHIRA 2-CHOME, AOBA-KU, SENDAI-SHI, MIYAGI, 980-8577, JAPAN
Covered Property
(1)
Copper Interconnection, Method for Forming Copper Interconnection Structure, and Semiconductor Device
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 16, 2009
From: SHIBATOMI, AKIHIRO
To: ADVANCED INTERCONNECT MATERIALS LLC
Reel/Frame 023387/0794 →
Assignment of Assignor's Interest
Mar 21, 2011
From: TOHOKU UNIVERSITY
To: ADVANCED INTERCONNECT MATERIALS, LLC
Reel/Frame 026008/0715 →
Assignment of Assignor's Interest
Mar 23, 2016
From: ADVANCED INTERCONNECT MATERIALS, LLC
To: TOHOKU UNIVERSITY
Reel/Frame 038078/0852 →
Assignment of Assignor's Interest
Jun 29, 2017
From: TOHOKU UNIVERSITY
To: MATERIAL CONCEPT, INC.
Reel/Frame 042859/0773 →
Change of Address
Dec 8, 2021
From: MATERIAL CONCEPT, INC.
To: MATERIAL CONCEPT, INC.
Reel/Frame 058393/0355 →
Assignment of Assignor's Interest
Dec 9, 2021
From: MATERIAL CONCEPT, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 058347/0498 →