IP Library › Assignment 026008/0715
Patent Assignment
Reel/Frame 026008/0715

Assignment of Assignor's Interest

Recorded: 2011-03-21 Pages: 3
Assignor
TOHOKU UNIVERSITY
Executed: 2011-02-07
Assignee
ADVANCED INTERCONNECT MATERIALS, LLC
6-6-40-402, AZA-AOBA, ARAMAKI AOBA-KU, SENDAI-SHI MIYAGI, 980-0845, JAPAN
Covered Properties (11)
Liquid Crystal Display Device and Manufacturing Method Therefor
Patent: 8,089,158 →
Application: 12/455,161 →
Publication: US 2009/0290116
Liquid Crystal Display Device
Patent: 8,164,701 →
Application: 12/583,165 →
Publication: US 2010/0045887
Copper Interconnection, Method for Forming Copper Interconnection Structure, and Semiconductor Device
Patent: 8,258,626 →
Application: 12/586,043 →
Publication: US 2010/0065967
Liquid Crystal Display Device and Manufacturing Method Therefor
Patent: 8,084,860 →
Application: 12/586,612 →
Publication: US 2010/0018614
Method for Forming Copper Interconnection Structures
Patent: 8,112,885 →
Application: 12/589,849 →
Publication: US 2010/0154213
Copper Interconnection Structure and Method for Forming Copper Interconnections
Patent: 8,324,730 →
Application: 12/589,852 →
Publication: US 2010/0155951
Copper Interconnection Structures and Semiconductor Devices
Patent: 8,169,079 →
Application: 12/589,949 →
Publication: US 2010/0155952
Liquid Crystal Display Device and Manufacturing Method Therefor
Patent: 8,451,394 →
Application: 12/799,163 →
Publication: US 2010/0201901
Copper Interconnection Structure, Semiconductor Device, and Method for Forming Copper Interconnection Structure
Patent: 8,163,649 →
Application: 12/803,377 →
Publication: US 2010/0267228
Copper Alloy and Liquid-Crystal Display Device
Patent: 7,940,361 →
Application: 12/803,943 →
Publication: US 2011/0032467
Contact Plug Structure, Semiconductor Device, and Method for Forming Contact Plug
Patent: 8,531,033 →
Application: 12/807,528 →
Publication: US 2011/0057317
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 14, 2009
From: KAWAKAMI, HIDEAKI
To: ADVANCED INTERCONNECT MATERIALS LLC
Reel/Frame 023233/0274 →
Assignment of Assignor's Interest Sep 14, 2009
From: KOIKE, JUNICHI
To: TOHOKU UNIVERSITY
Reel/Frame 023233/0336 →
Assignment of Assignor's Interest Oct 16, 2009
From: KOIKE, JUNICHI
To: NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY
Reel/Frame 023398/0700 →
Assignment of Assignor's Interest Oct 16, 2009
From: SHIBATOMI, AKIHIRO
To: ADVANCED INTERCONNECT MATERIALS LLC
Reel/Frame 023387/0794 →
Assignment of Assignor's Interest Dec 3, 2009
From: KOIKE, JUNICHI
To: TOHOKU UNIVERSITY
Reel/Frame 023606/0767 →
Assignment of Assignor's Interest Dec 3, 2009
From: SHIBATOMI, AKIHIRO
To: ADVANCED INTERCONNECT MATERIALS LLC
Reel/Frame 023606/0752 →
Assignment of Assignor's Interest Dec 3, 2009
From: KOIKE, JUNICHI
To: TOHOKU UNIVERSITY
Reel/Frame 023606/0786 →
Assignment of Assignor's Interest Dec 3, 2009
From: KOIKE, JUNICHI
To: TOHOKU UNIVERSITY
Reel/Frame 023606/0779 →
Assignment of Assignor's Interest Dec 3, 2009
From: SHIBATOMI, AKIHIRO
To: ADVANCED INTERCONNECT MATERIALS LLC
Reel/Frame 023606/0775 →
Assignment of Assignor's Interest Dec 3, 2009
From: SHIBATOMI, AKIHIRO
To: ADVANCED INTERCONNECT MATERIALS LLC
Reel/Frame 023606/0771 →
Assignment of Assignor's Interest Sep 23, 2010
From: KOIKE, JUNICHI
To: TOHOKU UNIVERSITY; ADVANCED INTERCONNECT MATERIALS LLC
Reel/Frame 025099/0750 →
Assignment of Assignor's Interest Sep 23, 2010
From: KOIKE, JUNICHI
To: ADVANCED INTERCONNECT MATERIALS LLC
Reel/Frame 025037/0926 →
Assignment of Assignor's Interest Oct 15, 2010
From: KOIKE, JUNICHI; NEISHI, KOUJI
To: TOHOKU UNIVERSITY
Reel/Frame 025156/0387 →
Assignment of Assignor's Interest Oct 15, 2010
From: SHIBATOMI, AKIHIRO
To: ADVANCED INTERCONNECT MATERIALS, LLC
Reel/Frame 025156/0417 →
Assignment of Assignor's Interest Mar 20, 2012
From: KAWAKAMI, HIDEAKI
To: ADVANCED INTERCONNECT MATERIALS, LLC
Reel/Frame 027895/0244 →
Assignment of Assignor's Interest Mar 20, 2012
From: KOIKE, JUNICHI
To: TOHOKU UNIVERSITY
Reel/Frame 027895/0116 →
Assignment of Assignor's Interest Apr 20, 2012
From: ADVANCED INTERCONNECT MATERIALS, LLC
To: ALTIAM SERVICES LTD. LLC
Reel/Frame 028083/0909 →
Assignment of Assignor's Interest Apr 23, 2012
From: ADVANCED INTERCONNECT MATERIALS, LLC
To: ALTIAM SERVICES LTD, LLC
Reel/Frame 028092/0060 →
Assignment of Assignor's Interest Apr 23, 2012
From: KAWAKAMI, HIDEAKI
To: ADVANCED INTERCONNECT MATERIALS, LLC
Reel/Frame 028092/0021 →
Assignment of Assignor's Interest Apr 23, 2012
From: KOIKE, JUNICHI
To: TOHOKU UNIVERSITY
Reel/Frame 028091/0965 →
Merger Oct 22, 2015
From: ALTIAM SERVICES LTD. LLC
To: XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY
Reel/Frame 036855/0346 →
Assignment of Assignor's Interest Mar 23, 2016
From: ADVANCED INTERCONNECT MATERIALS, LLC
To: TOHOKU UNIVERSITY
Reel/Frame 038078/0852 →
Assignment of Assignor's Interest Jun 29, 2017
From: TOHOKU UNIVERSITY
To: MATERIAL CONCEPT, INC.
Reel/Frame 042859/0773 →
Assignment of Assignor's Interest Aug 27, 2018
From: XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY
To: INTELLECTUAL VENTURES ASSETS 84 LLC
Reel/Frame 046717/0310 →
Assignment of Assignor's Interest Aug 23, 2019
From: BYLAS DISTRICT ECONOMIC ENTERPRISE LLC
To: MEC MANAGEMENT, LLC
Reel/Frame 050144/0082 →