Method for forming copper interconnection structures
View Patent ↗A method for forming a copper interconnection structure includes the steps of forming an opening in an insulating layer, forming a copper alloy layer including a metal element on an inner surface of the opening, and conducting a heat treatment on the copper alloy layer so as to form a barrier layer. An enthalpy of oxide formation for the metal element is lower than the enthalpy of oxide formation for copper. The heat treatment is conducted at temperatures ranging from 327° C. to 427° C. and for a time period ranging from 1 minute to 80 minutes.
1. A method for forming a copper interconnection structure, the method comprising the steps of:
forming an opening in an insulating layer;
forming a copper alloy layer including a metal element on an inner surface of the opening, wherein an enthalpy of oxide formation for the metal element is lower than the enthalpy of oxide formation for copper; and
conducting a heat treatment on the copper alloy layer so as to form a barrier layer, wherein:
said heat treatment is conducted:
at temperatures ranging from 327° C. to 427° C.,
for a time period ranging from 1 minute to 80 minutes, and
the copper alloy layer including the metal element comprises copper surface orientation of {111}, {001}, and {311} and the step of conducting the heat treatment comprises a step of removing the copper surface orientation of {311}.
2. The method as recited in claim 1 , wherein an atomic concentration of the metal element in the barrier layer is accumulated toward an outer surface of the barrier layer facing the insulating layer, and an atomic concentration of copper in the barrier layer is accumulated toward an inner surface of the barrier layer.
3. The method as recited in claim 2 , wherein the barrier layer further comprises an atomic concentration of oxygen accumulated toward the outer surface of the barrier layer showing similar distribution as the atomic concentration of the metal element.
4. The copper interconnection structure of claim 1 , wherein the heat treatment is conducted in an inert gas atmosphere with a flow rate of not less than 0.1 liter per minute and not more than 5.0 liter per minute.
5. The copper interconnection structure of claim 1 , wherein the metal element has a diffusion coefficient greater than a self diffusion coefficient of copper.
6. The copper interconnection structure of claim 1 , wherein the metal element comprises at least one or more of magnesium (Mg), manganese (Mn), aluminum (Al) and germanium (Ge).
7. The method as recited in claim 1 , wherein the copper alloy layer is formed in a vacuum atmosphere with a pressure of not more than 1 Pascal.
8. The method as recited in claim 7 , wherein the copper alloy layer is formed in a vacuum atmosphere with a pressure of not more than 0.1 Pascal.
9. The method as recited in claim 1 , wherein the copper alloy layer is formed from copper manganese alloy.
10. The method as recited in claim 1 , wherein the copper alloy layer has a multilayer structure.
11. The method as recited in claim 10 , wherein the multilayer structure comprises a layer including copper and a layer including manganese with an interchangeable order of deposition over the insulating layer.
12. The method as recited in claim 10 , wherein the multilayer structure comprises:
a first layer including germanium formed on the insulating layer, and
a second layer including copper manganese alloy deposited over the first layer.
13. The method as recited in claim 1 , further comprising a step of forming a layer comprising a second metal element on the insulating layer before forming the copper alloy layer.
14. The method as recited in claim 13 , wherein an enthalpy of oxide formation for the second metal element is lower than the enthalpy of oxide formation for silicon.
15. The method as recited in claim 13 , wherein the second metal element comprises at least one of scandium (Sc), titanium (Ti), vanadium (V), chrome (Cr), yttrium (Y), zirconium (Zr), niobium (Nb), antimony (Sb), hafnium (Hf), tantalum (Ta) and rhenium (Re).
16. The method as recited in claim 15 , wherein the second metal element comprises tantalum or titanium.
17. The method as recited in claim 13 , wherein the layer comprising the second metal element has a multilayer structure.
18. The method as recited in claim 17 , wherein the multilayer structure comprises:
a first layer comprising tantalum nitride formed on the insulating layer, and
a second layer comprising tantalum formed over the first layer.
19. The method as recited in claim 1 , wherein an intensity of X-ray diffraction peak of {111} face is stronger than an intensity of X-ray diffraction peak of {200} face.
20. The method as recited in claim 19 , wherein the intensity of X-ray diffraction peak of {111} face is about 10 times stronger than the intensity of X-ray diffraction peak of {200} face.
21. The method as recited in claim 1 , further comprising a step of depositing copper over the inner surface of the barrier layer so as to form an interconnection body.