Patent Assignment
Reel/Frame 023606/0786
Assignment of Assignor's Interest
Recorded: 2009-12-03
Pages: 4
Assignor
KOIKE, JUNICHI
Executed: 2009-10-23
Assignee
TOHOKU UNIVERSITY
1-1, KATAHIRA 2-CHOME, AOBA-KU, SENDAI-SHI, MIYAGI, 980-8577, JAPAN
Covered Property
(1)
Method for Forming Copper Interconnection Structures
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.