IP Library › Assignment 023606/0752
Patent Assignment
Reel/Frame 023606/0752

Assignment of Assignor's Interest

Recorded: 2009-12-03 Pages: 4
Assignor
SHIBATOMI, AKIHIRO
Executed: 2009-10-24
Assignee
ADVANCED INTERCONNECT MATERIALS LLC
6-6-40-402, AZA-AOBA, ARAMAKI, AOBA-KU, SENDAI-SHI, MIYAGI, 980-0845, JAPAN
Covered Property (1)
Method for Forming Copper Interconnection Structures
Patent: 8,112,885 →
Application: 12/589,849 →
Publication: US 2010/0154213
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 3, 2009
From: KOIKE, JUNICHI
To: TOHOKU UNIVERSITY
Reel/Frame 023606/0786 →
Assignment of Assignor's Interest Mar 21, 2011
From: TOHOKU UNIVERSITY
To: ADVANCED INTERCONNECT MATERIALS, LLC
Reel/Frame 026008/0715 →