IP Library › Assignment 025156/0387
Patent Assignment
Reel/Frame 025156/0387

Assignment of Assignor's Interest

Recorded: 2010-10-15 Pages: 5
Assignors
KOIKE, JUNICHI
Executed: 2010-08-25
NEISHI, KOUJI
Executed: 2010-08-30
Assignee
TOHOKU UNIVERSITY
1-1, KATAHIRA 2-CHOME, AOBA-KU, SENDAI-SHI, MIYAGI, 980-8577, JAPAN
Covered Property (1)
Contact Plug Structure, Semiconductor Device, and Method for Forming Contact Plug
Patent: 8,531,033 →
Application: 12/807,528 →
Publication: US 2011/0057317
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 15, 2010
From: SHIBATOMI, AKIHIRO
To: ADVANCED INTERCONNECT MATERIALS, LLC
Reel/Frame 025156/0417 →
Assignment of Assignor's Interest Mar 21, 2011
From: TOHOKU UNIVERSITY
To: ADVANCED INTERCONNECT MATERIALS, LLC
Reel/Frame 026008/0715 →