IP Library › Assignment 023606/0771
Patent Assignment
Reel/Frame 023606/0771

Assignment of Assignor's Interest

Recorded: 2009-12-03 Pages: 4
Assignor
SHIBATOMI, AKIHIRO
Executed: 2009-10-30
Assignee
ADVANCED INTERCONNECT MATERIALS LLC
6-6-40-402, AZA-AOBA, ARAMAKI, AOBA-KU, SENDAI-SHI, MIYAGI, 980-0845, JAPAN
Covered Property (1)
Copper Interconnection Structures and Semiconductor Devices
Patent: 8,169,079 →
Application: 12/589,949 →
Publication: US 2010/0155952
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 3, 2009
From: KOIKE, JUNICHI
To: TOHOKU UNIVERSITY
Reel/Frame 023606/0767 →
Assignment of Assignor's Interest Mar 21, 2011
From: TOHOKU UNIVERSITY
To: ADVANCED INTERCONNECT MATERIALS, LLC
Reel/Frame 026008/0715 →