Patent Assignment
Reel/Frame 058347/0537
Assignment of Assignor's Interest
Recorded: 2021-12-09
Pages: 2
Assignor
MATERIAL CONCEPT, INC.
Executed: 2021-11-25
Assignee
JX NIPPON MINING & METALS CORPORATION
2-10-4, TORANOMON, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Copper Interconnection Structure and Method for Forming Copper Interconnections
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 3, 2009
From: SHIBATOMI, AKIHIRO
To: ADVANCED INTERCONNECT MATERIALS LLC
Reel/Frame 023606/0775 →
Assignment of Assignor's Interest
Dec 3, 2009
From: KOIKE, JUNICHI
To: TOHOKU UNIVERSITY
Reel/Frame 023606/0779 →
Assignment of Assignor's Interest
Mar 21, 2011
From: TOHOKU UNIVERSITY
To: ADVANCED INTERCONNECT MATERIALS, LLC
Reel/Frame 026008/0715 →
Assignment of Assignor's Interest
Mar 23, 2016
From: ADVANCED INTERCONNECT MATERIALS, LLC
To: TOHOKU UNIVERSITY
Reel/Frame 038078/0852 →
Assignment of Assignor's Interest
Jun 29, 2017
From: TOHOKU UNIVERSITY
To: MATERIAL CONCEPT, INC.
Reel/Frame 042859/0773 →
Change of Address
Dec 8, 2021
From: MATERIAL CONCEPT, INC.
To: MATERIAL CONCEPT, INC.
Reel/Frame 058393/0355 →