IP Library › Assignment 020793/0785
Patent Assignment
Reel/Frame 020793/0785

Assignment of Assignor's Interest

Recorded: 2008-04-14 Pages: 3
Assignors
LEE, JIN-YUAN
Executed: 2008-03-04
LO, HSIN-JUNG
Executed: 2008-03-04
Assignee
MEGICA CORPORATION
ROOM 301, NO.47, PARK 2ND RD.,, HSINCHU, 300, TAIWAN
Covered Property (1)
Chip Assembly with Interconnection by Metal Bump
Patent: 8,193,636 →
Application: 12/045,029 →
Publication: US 2008/0284014
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →