Patent Assignment
Reel/Frame 020800/0797
Assignment of Assignor's Interest
Recorded: 2008-04-02
Pages: 4
Assignors
HONG, JONGWON
Executed: 2008-03-06
SEONG, GEUMJUNG
Executed: 2008-03-11
LEE, JONGMYEONG
Executed: 2008-03-11
LEE, HYUNBAE
Executed: 2008-03-11
CHOI, BONGHYUN
Executed: 2008-03-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including Interlayer Conductive Contacts and Methods of Forming the Same