IP Library Assignment 020856/0278
Patent Assignment
Reel/Frame 020856/0278

Assignment of Assignor's Interest

Recorded: 2008-04-24 Pages: 2
Assignors
YAMAMOTO, MASAYUKI
Executed: 2007-11-27
KANESHIMA, YASUJI
Executed: 2007-11-27
Assignee
NITTO DENKO CORPORATION
1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI, OSAKA, 567-8680, JAPAN
Covered Property (1)
Apparatus for Cutting the Protective Tape of Semiconductor Wafer
Patent: 7,896,050 →
Application: 11/979,931 →
Publication: US 2008/0184855
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 23, 2018
From: EOIR TECHNOLOGIES, INC.
To: POLARIS ALPHA ADVANCED SYSTEMS, INC.
Reel/Frame 046449/0439 →
Assignment of Assignor's Interest Apr 30, 2018
From: POLARIS ALPHA ADVANCED SYSTEMS, INC.
To: POLARIS ALPHA, LLC
Reel/Frame 045671/0046 →