Patent Assignment
Reel/Frame 020856/0278
Assignment of Assignor's Interest
Recorded: 2008-04-24
Pages: 2
Assignee
NITTO DENKO CORPORATION
1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI, OSAKA, 567-8680, JAPAN
Covered Property
(1)
Apparatus for Cutting the Protective Tape of Semiconductor Wafer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.