IP Library › Assignment 020878/0593
Patent Assignment
Reel/Frame 020878/0593

Assignment of Assignor's Interest

Recorded: 2008-04-30 Pages: 2
Assignors
NISHIMURA, TAKAO
Executed: 2008-03-10
KUMAGAYA, YOSHIKAZU
Executed: 2008-03-10
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-8588, JAPAN
Covered Property (1)
Wiring Board for Flip-Chip Mounting, Mounting Structure of Electronic Components on Wiring Board, and Semiconductor Device Including Wiring Board
Patent: 8,659,168 →
Application: 12/047,811 →
Publication: US 2008/0224325
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 9, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0089 →
Change of Name Jul 9, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024651/0744 →
Assignment of Assignor's Interest Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035508/0637 →