Patent Assignment
Reel/Frame 020892/0698
Assignment of Assignor's Interest
Recorded: 2008-05-01
Pages: 2
Assignee
SEIKO INSTRUMENTS INC.
8, NAKASE 1-CHOME, MIHAMU-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Property
(1)
Method of Fusing Trimming for Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.