Patent Assignment
Reel/Frame 020901/0302
Assignment of Assignor's Interest
Recorded: 2008-05-05
Pages: 8
Assignors
HAMANO, MANABU
Executed: 2008-02-06
KOMMU, SRIKANTH
Executed: 2008-02-05
PITNEY, JOHN A.
Executed: 2008-01-18
TORACK, THOMAS A.
Executed: 2008-02-29
HELLWIG, LANCE G.
Executed: 2008-01-16
Assignee
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE, ST. PETERS, MISSOURI, 63376
Covered Property
(1)
Susceptor for Improving Throughput and Reducing Wafer Damage
Application:
11/965,506 →
Publication:
US 2008/0314319
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Apr 1, 2011
From: MEMC ELECTRONIC MATERIALS, INC.; SUNEDISON LLC; SOLAICX
To: BANK OF AMERICA, N.A.
Reel/Frame 026064/0720 →
Security Agreement
Oct 1, 2012
From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 029057/0810 →
Release of Security Interest
Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
Release of Security Interest
Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
Security Agreement
Jan 30, 2014
From: SUNEDISON, INC.; SOLAICX; SUN EDISON, LLC; NVT, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 032177/0359 →
Release of Security Interest
Mar 3, 2014
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.
Reel/Frame 032382/0724 →