Patent Assignment
Reel/Frame 020915/0772
Assignment of Assignor's Interest
Recorded: 2008-04-25
Pages: 3
Assignors
CHO, SHI-YUN
Executed: 2008-04-23
SEO, HO-SEONG
Executed: 2008-04-23
CHOI, YOUN-HO
Executed: 2008-04-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
PCB having embedded IC and method for manufacturing the same