Patent Assignment
Reel/Frame 020947/0952
Assignment of Assignor's Interest
Recorded: 2008-05-13
Pages: 4
Assignors
YAMAZAKI, KEISHIN
Executed: 2008-02-19
NAKAMURA, IWAO
Executed: 2008-02-19
SASAJIMA, RYOTA
Executed: 2008-03-25
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO 101-8980, JAPAN
Covered Property
(1)
Substrate Processing Apparatus Having Covered Thermocouple for Enhanced Temperature Control
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.