Patent Assignment
Reel/Frame 020959/0066
Assignment of Assignor's Interest
Recorded: 2008-05-05
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Stacked Package and Method of Manufacturing the Same