Patent Assignment
Reel/Frame 020959/0270
Assignment of Assignor's Interest
Recorded: 2008-05-16
Pages: 2
Assignor
JUNG, OH JIN
Executed: 2008-05-14
Assignee
DONGBU HITEK CO., LTD.
891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property
(1)
Method for Adhering Semiconductor Devices
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.