Patent Assignment
Reel/Frame 020968/0662
Assignment of Assignor's Interest
Recorded: 2008-05-19
Pages: 3
Assignors
CHUNG, HYUN-SOO
Executed: 2008-05-09
JANG, DONG-HYEON
Executed: 2008-05-09
KIM, NAM-SEOG
Executed: 2008-05-09
KANG, SUN-WON
Executed: 2008-05-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property
(1)
Semiconductor Packages with Enhanced Joint Reliability and Methods of Fabricating the Same