Patent Assignment
Reel/Frame 020969/0430
Assignment of Assignor's Interest
Recorded: 2008-05-07
Pages: 3
Assignors
HWANG, TAE-JOO
Executed: 2008-04-21
CHUNG, TAE-GYEONG
Executed: 2008-04-21
AHN, EUN-CHUL
Executed: 2008-04-21
Assignee
SAMSUNG ELECTRONICS CO. LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Forming the Same