Patent Assignment
Reel/Frame 020970/0064
Assignment of Assignor's Interest
Recorded: 2008-05-20
Pages: 2
Assignor
GOLDMANN, LEWIS S
Executed: 2008-04-11
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Solder Mold Plates Used in Packaging Process and Method of Manufacturing Solder Mold Plates
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.