Patent Assignment
Reel/Frame 020973/0400
Assignment of Assignor's Interest
Recorded: 2008-05-20
Pages: 5
Assignors
SUH, DAEWOONG
Executed: 2006-11-08
LEHMAN, STEPHEN E., JR.
Executed: 2006-11-17
RENAVIKAR, MUKUL
Executed: 2006-11-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Solder Joint Reliability in Microelectronic Packaging