Patent Assignment
Reel/Frame 020993/0160
Assignment of Assignor's Interest
Recorded: 2008-05-19
Pages: 2
Assignor
CHEN, MENG-KUN
Executed: 2008-05-02
Assignee
LITE-ON SEMICONDUCTOR CORP.
9F, NO. 233-2, PAO-CHIAO ROAD, HSIN-TIEN CITY, TAIPEI HSIEN, R.O.C., TAIWAN
Covered Property
(1)
Image-Sensing Chip Package Module Adapted to Dual-Side Soldering
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.