Patent Assignment
Reel/Frame 021001/0231
Assignment of Assignor's Interest
Recorded: 2008-05-27
Pages: 4
Assignors
HIROTSURU, HIDEKI
Executed: 2008-03-26
IWAMOTO, GOH
Executed: 2008-03-24
TSUKAMOTO, HIDEO
Executed: 2008-03-26
MIYAI, AKIRA
Executed: 2008-03-31
SASAKI, YOSHIO
Executed: 2008-03-24
Assignee
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU, TOKYO, 103-8338, JAPAN
Covered Property
(1)
Aluminum-silicon carbide composite and heat dissipation device employing the same