Assignment of Assignor's Interest

Recorded: 2008-05-15 Pages: 3

Assignors

KITAMURA, KEIKO

Executed: 2008-03-27

SHIMIZU, TAKASHI

Executed: 2008-03-27

OHTA, TETSUJI

Executed: 2008-03-31

NAKATANI, MASAYUKI

Executed: 2008-03-27

Assignee

KIMOTO CO., LTD.

19-1, SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO 160-0022, JAPAN

Covered Property (1)

Material for forming electroless plate and method for producing electrolessly plated non-conductive substrate

Application: 12/153,207 →

Publication: US 2009/0035559

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.