Patent Assignment
Reel/Frame 021006/0747
Release by Secured Party
Recorded: 2008-05-29
Pages: 13
Assignors
AZURE VENTURE PARTNERS I, L.P.
Executed: 2004-07-23
AZURE VENTURES I, L.P.
Executed: 2004-07-23
AZURE PARTNERS I, L.P.
Executed: 2004-07-23
AZURE I, L.P.
Executed: 2004-07-23
SIEMENS VENTURE CAPITAL GMBH
Executed: 2004-07-23
Assignee
UECKER & ASSOCIATES
100 PINE STREET, SUITE 475, SAN FRANCISCO, CALIFORNIA, 94111
Covered Properties
(2)
Thermally and Mechanically Stable Low-Cost High Thermal Conductivity Structure for Single-Mode Fiber Coupling to Laser Diode
System and Method for Gettering Gas-Phase Contaminants Within a Sealed Enclosure
Patent:
7,160,368 →
Application:
10/424,006 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 25, 2003
From: WAKELIN, SUZANNE
To: POWERNETIX, INC.
Reel/Frame 014021/0209 →
Security Interest
Jul 22, 2003
From: POWERNETIX, INC.
To: AZURE VENTURE PARTNERS I, L.P.; AZURE VENTURES I, L.P.; AZURE PARTNERS I, L.P.; AZURE I, L.P.
Reel/Frame 013819/0579 →
Assignment of Assignor's Interest
Aug 24, 2004
From: POWERNETIX, INC.
To: EM4, INC.
Reel/Frame 015074/0946 →
Confirmation of Grant of Security Interest
Jun 26, 2008
From: EM4, INC.
To: MMV FINANCE INC.
Reel/Frame 021156/0239 →