Patent Assignment
Reel/Frame 021007/0736
Assignment of Assignor's Interest
Recorded: 2008-05-28
Pages: 4
Assignors
ARAKI, TAKAYUKI
Executed: 2008-01-31
SHIMADA, JUNICHI
Executed: 2008-02-01
OGAWA, HIROKAZU
Executed: 2008-01-31
FUJIMOTO, KAZUHIKO
Executed: 2008-02-01
FUJII, TSUTOMU
Executed: 2008-02-01
YASUI, TAKUYA
Executed: 2008-02-01
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Wiring Structure of Semiconductor Integrated Circuit Device, and Method and Device for Designing the Same
Application:
12/035,230 →
Publication:
US 2008/0197449
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.