IP Library Assignment 021017/0309
Patent Assignment
Reel/Frame 021017/0309

Assignment of Assignor's Interest

Recorded: 2008-05-29 Pages: 2
Assignors
YASUDA, TAKAKI
Executed: 2008-05-07
TOMOZAWA, HIDEKI
Executed: 2008-05-07
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Flip-Chip Type Semiconductor Light-Emitting Device, Method for Manufacturing Flip-Chip Type Semiconductor Light-Emitting Device, Printed Circuit Board for Flip-Chip Type Semiconductor Light-Emitting Device, Mounting Structure for Flip-Chip Type Semiconductor Light-
Patent: 8,022,419 →
Application: 12/095,480 →
Publication: US 2009/0159902
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 18, 2012
From: SHOWA DENKO KABUSHIKI KAISHA
To: TOYODA GOSEI CO., LTD.
Reel/Frame 029489/0249 →