Patent Assignment
Reel/Frame 021048/0226
Assignment of Assignor's Interest
Recorded: 2008-05-29
Pages: 7
Assignors
LEE, HSIANG-HUAN
Executed: 2008-04-17
LEE, MING HAN
Executed: 2008-04-17
YEH, MING-SHIH
Executed: 2008-04-17
YU, CHEN-HUA
Executed: 2008-04-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Low Resistance High Reliability Contact via and Metal Line Structure for Semiconductor Device