Patent Assignment
Reel/Frame 021058/0268
Assignment of Assignor's Interest
Recorded: 2008-06-06
Pages: 2
Assignor
INUI, TADAHISA
Executed: 2008-03-06
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Lead Frame, Molding Die, and Molding Method
Application:
12/045,805 →
Publication:
US 2008/0253104
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.