IP Library Patent Application 12045805
Patent Application
App. No. 12/045,805

LEAD FRAME, MOLDING DIE, AND MOLDING METHOD

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Quick Facts
Patent No.
US None
App. No.
12/045,805
Abstract

In a lead frame ( 36 ), inner leads ( 4 ), the terminal ends of support leads ( 2 ), and a die pad ( 3 ) are disposed in a molding area ( 11 ) molded with a molding resin ( 13 ) and a frame ( 1 ), the leading ends of the support leads ( 2 ), outer leads ( 5 ), and tie bars ( 6 ) are disposed outside the molding area ( 11 ). In the frame ( 1 ), slits ( 16 ) are formed by cutting on both sides of corners ( 15 ) disposed on the extension lines of the leading ends of the support leads ( 2 ).

Claims (60)

1 . A lead frame, comprising:

a frame;

support leads having leading ends connected to an inner side of the frame;

a die pad connected to terminal ends of the support leads;

a plurality of inner leads radially arranged at a predetermined spacing from the die pad;

outer leads extended from the inner leads and connected to the inner side of the frame; and

tie bars disposed on boundaries of the inner leads and the outer leads to connect the adjacent leads,

the lead frame having the inner leads, the terminals ends of the support leads, and the die pad in a molding area, and

the lead frame having the frame, the leading ends of the support leads, the outer leads, and the tie bars outside the molding area,

wherein the lead frame further comprises slits formed on both sides of corners disposed on extension lines of the leading ends of the support leads in the frame.

2 . The lead frame according to claim 1 , further comprising holes formed on the corners disposed on the extension lines of the leading ends of the support leads in the frame.

3 . The lead frame according to claim 1 , further comprising notches extended from the slits and cut to outside along widths of the support leads.

4 . The lead frame according to claim 1 , further comprising a step formed on the support lead,

wherein the step of the support lead is larger in width than a part other than the step of the support lead.

5 . A molding die used for clamping the lead frame according to claim 1 and molding the lead frame with resin, the molding die comprising an upper die body and a lower die body, the upper and lower die bodies comprising:

upper die and lower die first clamping portions for clamping an outer periphery of the molding area other than the support leads; and

upper die and lower die second clamping portions for clamping the corners disposed on the extension lines of the leading ends of the support leads in the frame,

wherein the upper die first clamping portions are fixed on the upper die body,

the upper die second clamping portions are movable in a vertical direction relative to the upper die body,

the lower die first clamping portions are fixed on the lower die body, and

the lower die second clamping portions are movable in the vertical direction relative to the lower die body.

6 . The molding die according to claim 5 , wherein the upper die second clamping portion and the lower die second clamping portion each have a bend forming portion for bending the corner.

7 . A molding die used for clamping the lead frame according to claim 2 and molding the lead frame with resin, the molding die comprising an upper die body and a lower die body, the upper and lower die bodies comprising upper die and lower die clamping portions for clamping an outer periphery of the molding area other than the support leads;

wherein the upper die clamping portions are fixed on the upper die body,

the lower die clamping portions are fixed on the lower die body,

one of the upper die body and the lower die body comprises die inserting members movable in a vertical direction,

the other die body comprises die receiving members movable in the vertical direction,

the die inserting member has a convex portion,

the die receiving member has a concave portion,

the convex portions can be inserted into and removed from the holes on the corners and can be fit into and removed from the concave portions, and

positions of the convex portions are, relative to positions of the holes when the support leads are thermally expanded, displaced to outside along lengths of the support leads,

8 . A molding die used for clamping the lead frame according to claim 3 and molding the lead frame with resin, the molding die comprising an upper die body and a lower die body, the upper and lower die bodies comprising upper die and lower die clamping portions for clamping an outer periphery of the molding area other than the support leads;

wherein the upper die clamping portions are fixed on the upper die body,

the lower die clamping portions are fixed on the lower die body,

one of the upper die body and the lower die body comprises die inserting members movable in a vertical direction,

the other die body comprises die receiving members movable in the vertical direction,

the die inserting member has a pair of convex portions,

the die receiving member has a pair of concave portions,

the convex portions can be inserted into and removed from the notches of the slits and can be fit into and removed from the concave portions, and

positions of the convex portions are, relative to positions of the notches when the support leads are thermally expanded, displaced to outside along lengths of the support leads.

9 . A molding method for molding the lead frame with resin by means of the molding die according to claim 5 , comprising the steps of:

clamping the outer periphery of the molding area other than the support leads of the lead frame by means of the upper die first clamping portions and the lower die first clamping portions;

clamping, after a certain delay in this state, the corners disposed on the extension lines of the leading ends of the support leads in the frame of the lead frame, by means of the upper die second clamping portions and the lower die second clamping portions; and

injecting a molding resin into the molding area from an injection portion to mold the lead frame.

10 . A molding method for molding the lead frame with resin by means of the molding die according to claim 6 , comprising the steps of:

clamping the outer periphery of the molding area other than the support leads of the lead frame by means of the upper die first clamping portions and the lower die first clamping portions;

clamping, after a certain delay in this state, the corners disposed on the extension lines of the leading ends of the support leads in the frame of the lead frame and bending the corners by means of the upper die second clamping portions and the lower die second clamping portions; and

injecting a molding resin into the molding area from an injection portion to mold the lead frame.

11 . A molding method for molding the lead frame with resin by means of the molding die according to claim 7 , comprising the steps of:

clamping the outer periphery of the molding area other than the support leads of the lead frame by means of the upper die clamping portions and the lower die clamping portions;

inserting, after a certain delay in this state, the convex portions of the die inserting members into the holes on the corners of the lead frame and fitting the convex portions into the concave portions of the die receiving members; and

injecting a molding resin into the molding area from an injection portion to mold the lead frame.

12 . The molding method according to claim 11 , wherein the molding resin is injected and filled into the molding area, the molding resin in the molding area is polymerized to complete posture, the convex portions of the die inserting members are removed from the concave portions of the die receiving members and are removed from the holes on the corners of the lead frame,

clamping of the upper die clamping portions and the lower die clamping portions is released, and then the molded lead frame is removed.

13 . A molding method for molding the lead frame with resin by means of the molding die according to claim 8 , comprising the steps of:

clamping the outer periphery of the molding area other than the support leads of the lead frame by means of the upper die clamping portions and the lower die clamping portions;

inserting, after a certain delay in this state, the convex portions of the die inserting members into the notches of the slits of the lead frame and fitting the convex portions into the concave portions of the die receiving members; and

injecting a molding resin into the molding area from an injection portion to mold the lead frame.

14 . The molding method according to claim 13 , wherein the molding resin is injected and filled into the molding area, the molding resin in the molding area is polymerized to complete postcure, the convex portions of the die inserting members are removed from the concave portions of the die receiving members and are removed from the notches of the slits of the lead frame,

clamping of the upper die clamping portions and the lower die clamping portions is released, and then the molded lead frame is removed.

Assignments (2)
CHANGE OF NAME Recorded Nov 20, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 6, 2008
From: INUI, TADAHISA
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 021058/0268 →