Patent Assignment
Reel/Frame 021072/0569
Assignment of Assignor's Interest
Recorded: 2008-06-10
Pages: 4
Assignors
MINAKAWA, ATSUSHI
Executed: 2008-05-09
SEKIYA, MAMORU
Executed: 2008-05-09
UMEZU, NORIO
Executed: 2008-05-09
Assignee
ONKYO CORPORATION
2-1, NISSHIN-CHO, NEYAGAWA-SHI, OSAKA, 572-8540, JAPAN
Covered Property
(1)
Semiconductor Device Including Main Substrate and Sub Substrates and Fabrication Method of the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.