Semiconductor device including main substrate and sub substrates
View Patent ↗A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device includes first heat generating devices mounted on the sub substrates, sub-substrate heatsinks mounted to the first heat generating devices, and a main-substrate heatsink mounted to the main substrate, wherein the sub-substrate heatsinks and the main-substrate heatsink are secured to each other, such that there is a predetermined positional relationship between the sub substrates and the main substrate.
1. A semiconductor device including a main substrate and one or more sub substrates, the semiconductor device comprising:
first heat generating devices mounted on the sub substrates;
sub-substrate heatsinks mounted to the first heat generating devices; and
a main-substrate heatsink mounted to the main substrate;
wherein the sub-substrate heatsinks and the main-substrate heatsink are secured to each other, such that the sub substrates and the main substrate are positioned orthogonally to each other; and
the sub-substrate heatsinks have an L-shaped cross-sectional area, are mounted, at their one end portions, to the first heat generating devices such that the one end portions are parallel to the sub substrates and, also, are secured, at the other end portions, to the main-substrate heatsink.
2. The semiconductor device according to claim 1 , further comprising a second heat generating device mounted on the main substrate,
wherein the main-substrate heatsink is mounted to the second heat generating device.
3. The semiconductor device according to claim 1 , wherein the main-substrate heatsink is directly mounted to the main substrate.
4. The semiconductor device according to claim 1 , wherein the first heat generating devices are mounted on the sub substrates in parallel to the sub substrates.
5. The semiconductor device according to claim 1 , further comprising a chassis to which the sub-substrate heatsinks or the main-substrate heatsink is secured.
6. The semiconductor device according to claim 1 , further comprising a heat conducting portion for transferring heat to a temperature sensor which is secured to the sub-substrate heatsinks or the main-substrate heatsink,
wherein the heat conducting portion is grounded.
7. The semiconductor device according to claim 1 , wherein each of the sub substrates is an amplifier substrate for a single channel and, when the semiconductor device comprises amplifiers for plural channels, the sub substrates and the sub-substrate heatsinks for the plural channels are provided.