Patent Assignment
Reel/Frame 021101/0885
Assignment of Assignor's Interest
Recorded: 2008-06-16
Pages: 4
Assignors
YOUSIF, IMAD
Executed: 2008-04-24
SHEYNER, ANCHEL
Executed: 2008-04-25
BALAKRISHNA, AJIT
Executed: 2008-04-24
FUNG, NANCY
Executed: 2008-04-28
RUI, YING
Executed: 2008-04-24
SALINAS, MARTIN JEFFREY
Executed: 2008-05-01
MERRY, WALTER R.
Executed: 2008-05-01
RAUF, SHAHID
Executed: 2008-04-24
Assignee
APPLIED MATERIALS, INC.
P.O. BOX 450A, LEGAL AFFAIRS DEPT., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Method and Apparatus for Removing Polymer from the Wafer Backside and Edge