Patent Assignment
Reel/Frame 021107/0872
Assignment of Assignor's Interest
Recorded: 2008-06-17
Pages: 3
Assignors
YANG, KU-FENG
Executed: 2008-06-12
CHIOU, WEN-CHIH
Executed: 2008-06-12
WU, WENG-JIN
Executed: 2008-06-12
SUNG, MING-CHUNG
Executed: 2008-06-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Performing Die-to-Wafer Stacking by Filling Gaps Between Dies