Patent Assignment
Reel/Frame 021121/0902
Assignment of Assignor's Interest
Recorded: 2008-06-09
Pages: 3
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSIN RD., CHU TUNG TOWN, HSIN CHU HSIEN, R.O.C., TAIWAN
Covered Property
(1)
Three-Dimensional Die-Stacking Package Structure