Patent Assignment
Reel/Frame 021160/0876
Assignment of Assignor's Interest
Recorded: 2008-06-17
Pages: 3
Assignors
SHIMOMURA, AKIHISA
Executed: 2008-06-09
OHNUMA, HIDETO
Executed: 2008-06-10
KAKEHATA, TETSUYA
Executed: 2008-06-09
MAKINO, KENICHIRO
Executed: 2008-06-11
Assignee
SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
398, HASE, ATSUGI-SHI, KANAGAWA-KEN, 243-0036, JAPAN
Covered Property
(1)
Manufacturing Method of Soi Substrate and Manufacturing Method of Semiconductor Device