Patent Assignment
Reel/Frame 021161/0513
Assignment of Assignor's Interest
Recorded: 2008-06-13
Pages: 2
Assignors
HUNG, MIN-SHUN
Executed: 2007-06-13
TSAI, YO-YI
Executed: 2007-06-13
HUANG, CHIEN-PING
Executed: 2007-06-13
HSIAO, CHENG-HSU
Executed: 2007-06-13
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG RD., TANTZU, TAICHUNG, ROC, TAIWAN
Covered Property
(1)
Heat Dissipation Package Structure and Method for Fabricating the Same