Patent Assignment
Reel/Frame 021199/0407
Assignment of Assignor's Interest
Recorded: 2008-07-07
Pages: 3
Assignors
FUNAYA, TAKUO
Executed: 2008-06-27
MURAI, HIDEYA
Executed: 2008-06-27
YAMAMICHI, SHINTARO
Executed: 2008-06-27
KIKUCHI, KATSUMI
Executed: 2008-06-27
HONDA, HIROKAZU
Executed: 2008-06-27
MIYAZAKI, SHINICHI
Executed: 2008-06-27
Assignees
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KANAGAWA, KAWASAKI-SHI, 211-8668, JAPAN
Covered Property
(1)
Multilayered Circuit Board with Second via Made from Second Material
Application:
12/160,132 →
Publication:
US 2009/0046441
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.