Patent Assignment
Reel/Frame 021204/0261
Assignment of Assignor's Interest
Recorded: 2008-07-08
Pages: 2
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, 104-0028, JAPAN
Covered Property
(1)
Semiconductor Package with Reduced Length Interconnect and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.