IP Library › Assignment 026779/0204
Patent Assignment
Reel/Frame 026779/0204

Assignment of Assignor's Interest

Recorded: 2011-08-19 Pages: 4
Assignor
ELPIDA MEMORY, INC.
Executed: 2011-08-16
Assignee
SEMICONDUCTOR PATENT CORPORATION
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, JAPAN
Covered Properties (20)
Semiconductor Memory Circuit Device and Method for Fabricating Same
Patent: 5,237,187 →
Application: 07/799,541 →
Method of Making a Semiconductor Memory Circuit Device
Patent: 5,389,558 →
Application: 08/104,014 →
Method of Making a Semiconductor Memory Circuit Device
Patent: 5,631,182 →
Application: 08/327,861 →
Semiconductor Memory Circuit Device and Method for Fabricating a Semiconductor Memory Device Circuit
Patent: 6,043,118 →
Application: 08/800,018 →
Method for Manufacturing Semiconductor Integrated Circuit Device
Patent: 6,828,242 →
Application: 10/223,317 →
Publication: US 2003/0040183
Method for Manufacturing Semiconductor Integrated Circuit Device
Patent: 7,224,034 →
Application: 10/978,469 →
Publication: US 2005/0087880
Semiconductor Memory
Patent: 7,304,900 →
Application: 11/386,650 →
Publication: US 2006/0215478
Semiconductor Device
Patent: 7,391,113 →
Application: 11/391,449 →
Publication: US 2006/0249842
Semiconductor Device and Manufacturing Method Thereof
Patent: 7,504,698 →
Application: 11/471,680 →
Publication: US 2006/0284264
Semiconductor Device Having Fuse Element Arranged Between Electrodes Formed in Differect Wiring Layers
Patent: 7,550,788 →
Application: 11/651,027 →
Publication: US 2007/0176256
Command Generating Circuit and Semiconductor Memory Device Having the Same
Patent: 7,492,661 →
Application: 11/651,033 →
Publication: US 2007/0159910
Method for Manufacturing Semiconductor Integrated Circuit Device
Patent: 7,417,291 →
Application: 11/785,463 →
Publication: US 2007/0187783
Semiconductor Memory
Patent: 7,542,359 →
Application: 11/875,390 →
Publication: US 2008/0062784
Semiconductor Memory Device Having Plural Memory Cell Arrays
Patent: 7,652,904 →
Application: 11/956,448 →
Publication: US 2008/0144346
Semiconductor Device
Patent: 7,538,431 →
Application: 12/126,681 →
Publication: US 2008/0224311
Method for Manufacturing Semiconductor Integrated Circuit Device
Patent: 7,687,849 →
Application: 12/128,796 →
Publication: US 2008/0237752
Semiconductor Memory Device
Patent: 7,864,618 →
Application: 12/137,802 →
Publication: US 2009/0003026
Semiconductor Package with Reduced Length Interconnect and Manufacturing Method Thereof
Patent: 7,812,439 →
Application: 12/169,072 →
Publication: US 2009/0014874
Semiconductor Device and Manufacturing Method Thereof
Patent: 7,919,405 →
Application: 12/364,801 →
Publication: US 2009/0142913
Semiconductor Memory
Patent: 7,808,848 →
Application: 12/394,550 →
Publication: US 2009/0168572
Related Assignments (23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Feb 5, 1993
From: UCHIYAMA, HIROYUKI; KANEKO, YOSHIYUKI; YONEOKA, TAKASHI; WATANAVE, KOZO
To: HITACHI, LTD.
Reel/Frame 006426/0076 →
Assignment of Assignors Interest. Feb 5, 1993
From: SOEDA, HIROKI
To: HITACHI, LTD.
Reel/Frame 006402/0396 →
Assignment of Assignors Interest. Feb 5, 1993
From: SUWANAI, NAOKATSU; MIYAZAWA, HIROYUKI; OGISHIMA, ATUSHI; NAGAO, MASAKI
To: HITACHI, LTD.
Reel/Frame 006409/0424 →
Assignment of Assignor's Interest Aug 20, 2002
From: KUJIRAI, HIROSHI; OKUYAMA, KOUSUKE; HATA, KAZUHIRO; OYU, KIYONORI
To: HITACHI, LTD.; NEC CORPORATION
Reel/Frame 013209/0065 →
Assignment of Assignor's Interest Sep 24, 2003
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 014526/0388 →
Assignment of Assignor's Interest Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014554/0445 →
Assignment of Assignor's Interest Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →
Assignment of Assignor's Interest Aug 9, 2004
From: RENESAS TECHNOLOGY CORP.
To: HITACHI, LTD.
Reel/Frame 015057/0526 →
Assignment of Assignor's Interest Mar 23, 2006
From: SHIBATA, TOMOYUKI; OISHI, KANJI
To: ELPIDA MEMORY, INC.
Reel/Frame 017844/0202 →
Assignment of Assignor's Interest Jun 21, 2006
From: TAGUWA, TETSUYA
To: ELPIDA MEMORY, INC.
Reel/Frame 018014/0426 →
Assignment of Assignor's Interest Jun 27, 2006
From: ISA, SATOSHI; KATAGIRI, MITSUAKI; OSANAI, FUMIYUKI
To: ELPIDA MEMORY, INC.
Reel/Frame 018034/0301 →
Assignment of Assignor's Interest Oct 19, 2006
From: HITACHI, LTD.
To: ELPIDA MEMORY, INC.
Reel/Frame 018420/0080 →
Assignment of Assignor's Interest Nov 24, 2006
From: NEC CORPORATION
To: ELPIDA MEMORY, INC.
Reel/Frame 018601/0875 →
Assignment of Assignor's Interest Nov 24, 2006
From: HITACHI, LTD.
To: ELPIDA MEMORY, INC.
Reel/Frame 018597/0200 →
Assignment of Assignor's Interest Nov 24, 2006
From: NEC ELECTRONICS CORPORATION
To: ELPIDA MEMORY, INC.
Reel/Frame 018597/0213 →
Assignment of Assignor's Interest Nov 24, 2006
From: NEC ELECTRONICS CORPORATION
To: ELPIDA MEMORY, INC.
Reel/Frame 018601/0839 →
Assignment of Assignor's Interest Nov 24, 2006
From: NEC CORPORATION
To: ELPIDA MEMORY, INC.
Reel/Frame 018627/0359 →
Assignment of Assignor's Interest Jan 9, 2007
From: OGAWA, SUMIO
To: ELPIDA MEMORY, INC.
Reel/Frame 018780/0932 →
Assignment of Assignor's Interest Jan 9, 2007
From: YOSHIDA, HIROYASU; OISHI, KANJI
To: ELPIDA MEMORY, INC.
Reel/Frame 018776/0428 →
Assignment of Assignor's Interest Dec 14, 2007
From: DONO, CHIAKI; KOSHIKAWA, YASUJI; SUZUKI, JUN
To: ELPIDA MEMORY, INC.
Reel/Frame 020246/0704 →
Assignment of Assignor's Interest Jun 12, 2008
From: RIHO, YOSHIRO; OISHI, HAYATO; HARAGUCHI, YOSHINORI; MATSUI, YOSHINORI
To: ELPIDA MEMORY, INC.
Reel/Frame 021087/0190 →
Assignment of Assignor's Interest Jul 8, 2008
From: WATANABE, MITSUHISA; ANJO, ICHIRO
To: ELPIDA MEMORY, INC.
Reel/Frame 021204/0261 →
License Nov 8, 2011
From: SEMICONDUCTOR PATENT CORPORATION
To: SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 027193/0103 →