Patent Assignment
Reel/Frame 021246/0835
Assignment of Assignor's Interest
Recorded: 2008-07-16
Pages: 2
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device with Connecting via and Dummy Via
Application:
12/174,330 →
Publication:
US 2008/0305628
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.