Patent Assignment
Reel/Frame 021251/0706
Assignment of Assignor's Interest
Recorded: 2008-07-17
Pages: 4
Assignors
YOON, CHEAL-SANG
Executed: 2008-07-10
HA, YONG-DAE
Executed: 2008-07-11
LEE, JAE-RYOUNG
Executed: 2008-07-13
CHO, JEONG-SOON
Executed: 2008-07-13
LEE, BUM-WOO
Executed: 2008-07-11
KIM, PIL-JUNE
Executed: 2008-07-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Bonding Apparatus