Assignment of Assignor's Interest

Recorded: 2008-07-17 Pages: 4

Assignor

LEE, TAE HEON

Executed: 2001-01-15

Assignee

AMKOR TECHNOLOGY, INC.

1900 SOUTH PRICE RD., CHANDLER, ARIZONA, 85248

Covered Property (1)

Semiconductor Package Having Reduced Thickness

Application: 11/947,505 →

Publication: US 2008/0283979

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.